ANALISIS PERFORMA KOMPONEN THROUGH - HOLE TEKNOLOGI (THT) DAN SURFACE MOUNT DEVICES (SMD) UNTUK RANGKAIAN MODERN

PERFORMANCE ANALYSIS OF THROUGH-HOLE TECHNOLOGY (THT) AND SURFACE MOUNT DEVICES (SMD) COMPONENTS FOR MODERN CIRCUITS

Abstrak

Today's electronics industry demands smaller, more functional, and more durable products. These needs are largely met by Surface Mount Technology (SMT) using Surface Mount Devices (SMD). However, Through-Hole Technology (THT) remains essential for applications requiring good heat distribution and mechanical strength. The shift to lead-free soldering brings new challenges related to joint reliability, particularly in terms of thermal fatigue. This study aims to review various ways to improve quality, reliability, and efficiency in modern electronics assembly processes through materials analysis, inspection development, and manufacturing process improvements.The research method used a qualitative analytical literature review, combining six scientific journals focused on three themes: solder reliability (Through-Hole Technology (THT) & Surface Mount Devices (SMD)), Automatic Optical Inspection (AOI), and manufacturing optimization. The main results of the study indicate: (1) To accurately estimate the lifespan of Surface Mount Devices (SMD) components, a Finite Element Analysis (FEA) model that takes into account uneven temperature distribution is required. (2) Difficult Through Hole Technology (THT) inspection can be improved with a 3D reconstruction-based AOI system capable of accurately measuring solder volume. (3) Surface Mount Devices (SMD) manufacturing process can be maximized by classifying five types of pick-and-place machines for efficient scheduling strategies. In addition, the innovation of Light Emitting Diode (LED) Surface Mount Devices (SMD) as light sources/filters in spectrophotometers shows potential for smaller and more cost-effective designs. The study recommends the development of Design for Manufacturing (DFM) standards that address leadless solder failure mechanisms as well as the adoption of 3D Automatic Optical Inspection (AOI) for Through Hole Technology (THT).